1
TIM 2
DOWSIL™ TC-5888 Thermal Grease
• Solvent-free
• Very low thermal resistance
• High thermal conductivity
• Achieves thin bond line thickness
• Good processability offering low volatile content
x
TIM 1.5
DOWSIL™ TC-5550 Thermal Conductive Compound
• Print on heat sink
• Solvent-free
• High thermal conductivity
• Excellent anti-pump-out performance
x
Chipset
DOWSIL™ TC-30XX Series Silicone
• High thermal conductivity (available from 2 to 11 W/mK
• No oil bleeding issue after fully cured
• Excellent anti-slumping/cracking
• No silicone oil contamination issue
x
