DOWSIL™ TC-5888 Thermally Conductive Compound

• Solvent-free formulation
• Very low thermal resistance
• High thermal conductivity - up to 5.2 W/mK
• Achieves thin bond line thickness - 0.02 mm at low pressure
• Good processability, offering low volatile content vs. competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall

High-end TIM 2 thermal grease

DOWSIL™ TC-5550 Thermal Conductive Compound

• Easily prints on heat sink
• Solvent-free formulation
• High thermal conductivity up to 5.2 W/mK
• Excellent anti-pump-out performance after thermal cycling
• Fit for lidless die design

TIM 1.5 thermal grease for lidless design

DOWSIL™ TC-3015 Re-workable Thermal Gel
DOWSIL™ TC-3035 Reworkable Thermal Gel
DOWSIL™ TC-3065 Thermal Gel

Used for both heat dissipation and gap filling

• High thermal conductivity (available from 2 to 11 W/mK)
• No oil bleeding after full cure
• Excellent anti-slumping/cracking
• No silicone oil contamination

Effectively dissipates heat from ethernet switch chipset