1. CPU

DOWSIL™ TC-5888 Thermally Conductive Compound

Thermal grease for server CPU
  • Solvent-free formulation
  • Very low thermal resistance
  • High thermal conductivity up to 5.2 W/mK
  • Achieves thin bond line thickness - 0.02 mm at low pressure
  • Good processability that offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall
Efficient thermal transfer for cooling the server’s CPU

2. Coupling agent

DOWSIL™ Z-6269 Silane

Silane for e-glass fabric treatment
  • Compatible with epoxies for PCBs, polyolefins, most polymer types
  • For organic resins on glass fabrics in PCB composites
  • Improved wet and dry physical properties of composite
  • Improved mixing and compatibility of filled systems
Improved adhesion of organic polymer to inorganic substrate or filler

3. GPU

DOWSIL™ TC-5550 Thermal Conductive Compound

  • Easily prints on heat sink
  • Solvent-free formulation
  • High thermal conductivity up to 5.2 W/mK
  • Excellent anti-pump-out performance after thermal cycling
  • Fit for lidless die design
TIM 1.5 thermal grease for server GPU

4. SSD

DOWSIL™ TC-4040 Dispensable Thermal Pad
DOWSIL™ TC-4060 Thermal Gel

  • Two-part, liquid, curable thermal gel
  • SSD heat dissipation
  • High reliability
  • Controlled volatile content
  • Thermal conductivity of 4-6.5 W/mK
Dispensable pads deliver better heat dissipation than fabricated thermal pads

5. Immersion cooling

DOWSIL™ ICL-1000

  • Excellent thermal management properties
    • High thermal conductivity
    • High specific heat
  • Outstanding thermal stability and oxidation resistance – long term service
  • Compatible with devices and components in server
  • Compatible with various materials used in server – hydrocarbon, silicone and metals
  • Environment friendly – very low Global Warming Potential (GWP) and zero Ozone Depletion potential (ODP)

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