1. CPU
DOWSIL™ TC-5888 Thermally Conductive Compound
Thermal grease for server CPU- Solvent-free formulation
- Very low thermal resistance
- High thermal conductivity up to 5.2 W/mK
- Achieves thin bond line thickness - 0.02 mm at low pressure
- Good processability that offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall
2. Coupling agent
Silane for e-glass fabric treatment
- Compatible with epoxies for PCBs, polyolefins, most polymer types
- For organic resins on glass fabrics in PCB composites
- Improved wet and dry physical properties of composite
- Improved mixing and compatibility of filled systems
3. GPU
DOWSIL™ TC-5550 Thermal Conductive Compound
- Easily prints on heat sink
- Solvent-free formulation
- High thermal conductivity up to 5.2 W/mK
- Excellent anti-pump-out performance after thermal cycling
- Fit for lidless die design
4. SSD
DOWSIL™ TC-4040 Dispensable Thermal Pad
DOWSIL™ TC-4060 Thermal Gel
- Two-part, liquid, curable thermal gel
- SSD heat dissipation
- High reliability
- Controlled volatile content
- Thermal conductivity of 4-6.5 W/mK
5. Immersion cooling
- Excellent thermal management properties
- High thermal conductivity
- High specific heat
- Outstanding thermal stability and oxidation resistance – long term service
- Compatible with devices and components in server
- Compatible with various materials used in server – hydrocarbon, silicone and metals
- Environment friendly – very low Global Warming Potential (GWP) and zero Ozone Depletion potential (ODP)
