DOWSIL™ TC-5550 Thermal Conductive Compound

• High thermal conductivity of up to 5.3 W/mK
• Excellent anti-pump-out performance, specifically for lidless die design

TIM 1.5 Thermal grease for lidless CPU and GPU

SILASTIC™ DY 35-4088 Liquid Silicone Rubber

• 40 JIS-type A hardness
• Extremely long fatigue life

Long fatigue life LSR for keypad dome

DOWSIL™ TC-4040 Dispensable Thermal Pad
DOWSIL™ TC-4060 Thermal Gel

• Two-part, liquid, curable thermal gel
• SSD heat dissipation
• High reliability
• Controlled volatile conten
• Thermal conductivity of 4-6.5 W/mK

Dispensed thermal pads deliver better heat dissipation than fabricated thermal pads

DOWSIL™ Optical Silicone Hot-Melt Film

• Optical encapsulant for applications such as mini LED chips
• High transparency film (also available in black)
• Excellent stress relief for warp-free encapsulation
• Excellent adhesion to various substrates
• Easy processability
• Tunable viscosity for substrate shape
• Post-lamination cure
• Retains performance, even at temperatures exceeding 100°C
• Thermal bonding with vacuum press/lamination device

Applied by compression molding or vacuum lamination, dry-process encapsulation can be a better solution for large substrates and where curable liquid silicones are difficult to use.

DOWSIL™ 280A Adhesive

• Silicone pressure sensitive adhesive
• Excellent adhesion on silicone rubber
• Good tack for assembly
• High-viscosity liquid

Adhesion to 260°C

DOWSIL™ 7429 PSA Additive

• Silicone pressure sensitive adhesive
• Excellent adhesion on silicone rubber
• Good tack for assembly

DOWSIL™ 7268 Adhesive

• Silicone pressure sensitive adhesive
• High tack
• Excellent attachment on metal
• Masking and process adoption

Adhesion to 240°C