1. Heat dissipation (CPU/GPU)

DOWSIL™ TC-5550 Thermal Conductive Compound

  • High thermal conductivity of up to 5.3 W/mK
  • Excellent anti-pump-out performance, specifically for lidless die design
TIM 1.5 Thermal grease for lidless CPU and GPU

2. Molding

SILASTIC™ DY 35-4088 Liquid Silicone Rubber

  • 40 JIS-type A hardness
  • Extremely long fatigue life
Long fatigue life LSR for keypad dome

3. Heat dissipation (SSD)

DOWSIL™ TC-4040 Dispensable Thermal Pad
DOWSIL™ TC-4060 Thermal Gel

  • Two-part, liquid, curable thermal gel
  • SSD heat dissipation
  • High reliability
  • Controlled volatile conten
  • Thermal conductivity of 4-6.5 W/mK

Dispensed thermal pads deliver better heat dissipation than fabricated thermal pads

4. Optical LED encapsulation

DOWSIL™ Optical Silicone Hot-Melt Film
  • Optical encapsulant for applications such as mini LED chips
  • High transparency film (also available in black)
  • Excellent stress relief for warp-free encapsulation
  • Excellent adhesion to various substrates
  • Easy processability
  • Tunable viscosity for substrate shape
  • Post-lamination cure
  • Retains performance, even at temperatures exceeding 100°C
  • Thermal bonding with vacuum press/lamination device
Applied by compression molding or vacuum lamination, dry-process encapsulation can be a better solution for large substrates and where curable liquid silicones are difficult to use.

5. Keypad lamination

DOWSIL™ 280A Adhesive
  • Silicone pressure sensitive adhesive
  • Excellent adhesion on silicone rubber
  • Good tack for assembly
  • High-viscosity liquid
Adhesion to 260°C

DOWSIL™ 7429 PSA Additive
  • Silicone pressure sensitive adhesive
  • Excellent adhesion on silicone rubber
  • Good tack for assembly

6. Metal frame processing

DOWSIL™ 7268 Adhesive
  • Silicone pressure sensitive adhesive
  • High tack
  • Excellent attachment on metal
  • Masking and process adoption
Adhesion to 240°C
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