1. Chip heat dissipation

DOWSIL™ TC-3015 Reworkable Thermal Gel

DOWSIL™ TC-3035 Reworkable Thermal Gel

DOWSIL™ TC-3065 Thermal Gel

  • High thermal conductivity (available from 2 to 11 W/mK)
  • Excellent anti-slumping and cracking
  • No silicone oil contamination
Effectively dissipates heat

2. EMI Shielding

DOWSIL™ EC-6601 Electrically Conductive Adhesive

  • One-part RTV
  • Strong adhesion to many substrates
  • Excellent elongation
  • Reliable performance with durable mechanical and conductive properties
Privacy Policy