1. PCB Protection

DOWSIL™ 1-2577 Low VOC Conformal Coating

  • One-part, medium-viscosity, transparent coating
  • Room-temperature cure, with optional mild heat acceleration
  • Cures to a tough elastoplastic with resilient, abrasion-resistant surface
  • UV indicator
  • Protective coating for rigid and flexible circuit boards and PCB system printed wiring board (PWB) applications, especially those requiring toughness/abrasion resistance
UL, IPC and Mil Spec approved

DOWSIL™ 3-1953 Conformal Coating

  • One-part, medium-viscosity, translucent coating
  • Fast, moisture RTV cure, with optional mild heat acceleration
  • Soft, stress-relieving, elastomeric coating
  • UV indicator
  • No added solvents
  • Protective coating for rigid and flexible circuit boards, electronic printed wiring boards (PWB), sensitive components and fine pitched designs
UL, IPC and Mil Spec approved

2. Grounding and EMI shielding

DOWSIL™ EC-6601 Electrically Conductive Adhesive

  • One-part, RTV adhesive/sealant or gasket
  • Designed for electromagnetic compatibility (EMC)
  • Flexible joint design enabled by greater than 150% elongation
  • Adheres to a variety of substrates
  • High elongation and stable conductivity
  • Durable mechanical/conductive properties
EMI shielding adhesive with reliable performance

DOWSIL™ EC-8634 Electrically Conductive Adhesive

Electrically conductive material for grounding and EMI shielding

3. Module sealing/assembly

DOWSIL™ EA-4700 CV Adhesive

  • Two-part, fast cure at room temperature (or heat accelerated)
  • Durable adhesion to typical substrates (aluminum, PBT, PPS)
  • Controlled silicone volatility
  • Good sealing against the environment
  • High temperature stability
  • 600% elongation, suitable for larger modules
Cost-effective, fast assembly solution for battery packs and ADAS sensor modules, including radar, LiDAR and cameras

DOWSIL™ SE 9168 RTV Adhesive

Fast assembly adhesive
  • One-part, RTV moisture cure, non-flowing adhesive
  • Fast tack-free time
  • Controlled silicone volatility
  • Good flame resistance, UL 94 V-0 Flammability rating
For parts fixing on circuit boards and in modules, and for vibration damping of fixed components

4. Heat dissipation

DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

  • Dissipates heat from electronics mounted on PCB to heat sink
  • Two-part, room-temperature cure
  • Soft, compressible material
  • Controlled silicone volatility
  • Thermal conductivity of >2.5 W/mK
Reliable cooling solution for modules like engine or transmission control units

DOWSIL™ TC-4040 Dispensable Thermal Pad

  • Two-part, liquid, curable thermal gel
  • Forms a soft thermal pad for gap filling, heat dissipating, stress relieving and shock damping
  • Dispensed or printed through a variety of manual or automated processes
  • Room-temperature cure (or heat to accelerate)
  • Thermal conductivity of 4 W/mK
  • UL 94 V-0 listing
Dispensed pads dissipate heat generated by the PCB

5. Connector potting

DOWSIL™ EE-1100 Black Encapsulant

  • Two-part, highly flexible elastomer for connector potting
  • RTV or heat cure
  • No exotherm during cure
  • No solvents or cure byproducts
  • Good dielectric properties
  • Stress relieving
  • Repairable
Used on connectors, power supplies, sensors, industrial controls, transformers, amplifiers, high-voltage resistor packs and solar cells

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

  • Two-part, fast cure with optimized working time
  • Low viscosity, fills small gaps
  • Very low hardness, minimizing internal stress generation
  • Effective heat dissipation
  • Protection against water ingress
  • Electrically insulative
  • Excellent flame resistance
Improves safety and reliability under harsh outdoor environments
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